Enhance Your High-Performance Product With Innovative Material

The miniaturization trend in electronic devices requires smaller, more durable, and higher-performing materials. Dow Corning can help you find a solution to achieve these goals in your epoxy molding compound application. With Dow Corning® brand Plastic and Composite Additives, you not only get the benefits of our innovative materials, you can also collaborate with our experts to find the product that best meets your engineering requirements and business expectations – for today and for tomorrow.

Dow Corning® brand Plastic and Composite Additives can help you maximize the efficiency of your processes, achieve your quality goals, and reach new levels of performance demanded by today’s ever-advancing electronics market.

When added to epoxy molding compound, Dow Corning® brand Plastic and Composite Additives:

• Provide stress relief during heat cycling (minimizing cracking, distortion, and warpage)
• Improve adhesion to embedded electronic components at elevated temperature and humidity
• Enable better moldability
• Reduce viscosity, resulting in higher molding-process throughput
• Impart flame resistance

Contact us now to learn how our experts will work closely with you to help you select an existing Dow Corning® brand Plastic and Composite Additives product or develop a customized material to improve the performance of your epoxy molding compound.

Applicable Markets and Applications

• Electronic chip encapsulants
• Other electronic materials applications