액상방열 실리콘

With increased miniaturization of systems and increased circuit density, today’s electronics generate larger amounts of heat.  If this heat is not carried off and dissipated, the operational lifetime and reliability of the electronic system can be reduced.

Heat sinks and fans are mechanical means that are increasingly used to keep the temperature of electronic circuits at a minimum, but materials also play a critical role.  Dow Corning makes a wide variety of curing adhesives, gels and encapsulants, plus non-curing compounds with excellent thermal conductivity values.  They are durable as well as stress relieving for use on sensitive electronic components and connections.

Key Characteristics

Dow Corning’s thermally conductive materials

•Are stable over wide temperature ranges

•Provide a low stress environment and can compensate for the mismatch in the coefficient of thermal expansion between two substrates

•Have good dielectric properties to maintain electrical isolation

•When used as a cured adhesive, can eliminate the need for mechanical fasteners

•Are supplied as uncured liquids and pastes to facilitate high volume processing in automated production.  

•Come in a variety of material forms to meet a wide range of uses and application requirements.