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Silicone Adhesives and Sealants
Adhesives are used primarily to attach components, such as module lids and
baseplates, within electronic modules or seal openings in the module to exclude
dirt, water or other contaminants. A key benefit of Dow Corning ®
Adhesives is their potential to significantly increase reliability of the
electronic module or component because of their stress-relieving
properties. Dow Corning Adhesives have a “rubbery”, elastomeric nature
and are not traditional, highly rigid adhesives. This low stress
environment can reduce damage to module components and
interconnections. They are also able to maintain their stress-relieving
nature throughout exposures to extreme environmental conditions like high
temperature and humidity.
Dow Corning Adhesives also offer versatile processing. Some are cured
at room temperature, while others can be accelerated by heat. This can
allow faster process times or the use of lower temperature capable materials,
depending on the needs of your application and process. Newer developed
products are resulting in even faster and lower temperature curing
capability.
Improvements have also been made in our newer adhesive products in their
ability to form protective layers over metals to reduce corrosion and metal
migration. This can increase their usefulness in such applications as
protection of the electrodes of flat panel displays.
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Dow Corning’s line of adhesives is also offered in a range of flow
properties to fill gaps and channels, or to remain in place as the application
requires. Many of the flowable products will self-level to fill channels
and cavities.
Other sets of Dow Corning Adhesives are used in semiconductor device
packaging as lid adhesives (link), thermal interface materials (link), and die
attach adhesives (link). These products are covered in other
tutorials.
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