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For Baseplate/Housing Attach select one of Dow Corning's Adhesive/Sealants.
Here are some items for considerations in choosing the appropriate material for
your use:
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One or two-part heat curing adhesive/sealants offer higher throughput and
faster processing times. Heat cure times typically are shorter with increasing
temperatures. If heat cure is not practical choose a room temperature curing
product.
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One-part materials are easier to handle, two-part materials often offer
faster processing. Two-part materials are typically 1:1 mix ratio with a few at
10:1.
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For baseplate/housing attach, flowable materials are generally preferred
for use in grooves or when applied over large areas. Non slump materials are
preferred for perimeter sealing or for beads on flat surfaces.
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If your circuit contains power or heat generating devices, pick a higher
thermal conductivity product.
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A number of these products have UL or Mil Spec approvals.
Additional Information:
Adhesive/Sealant
Product Information
Thermally
Conductive Adhesive Product Information
Adhesives/Sealants
Tutorial
Thermally
Conductive Materials Tutorial
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