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Dow Corning® brand photoresist resins are for use as the
silicon resin raw material for advanced 193 nm bilayer photoresist
formulations. We are custom designing, developing, and commercializing them to
meet the unique needs of leading photoresist material suppliers.
Performance Properties: Etch resistant, solution stability, no
outgassing
Physical Form: Liquid solution of silicon resin in carrier
solvent
Typical Resins: Customized silsesquioxane resins
Application Use: Silicon resin raw material for 193 nm bilayer
photoresist formulations
Need a customized silicon resin for your advanced bilayer photoresist
formulation?
Contact us to
learn how we can help you develop next generation technology, today.
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