| Electronic Ignition modules – accurate
electronic ignition controlling becomes more and more relevant. Dow Corning is
very active in the market of electronic ignition modules, as well as in the
segment of igniter protection. The leader in silicone materials would like to
offer you the below material solutions. |
 | Gels |
| Gels are a special class of
encapsulants that cure to an extremely soft material. Cured gels retain much of
the stress relief and self-healing qualities of a liquid while providing the
dimensional stability of an elastomer. |
| Encapsulants |  |
| Encapsulants (or pottants) are
protective materials used to completely embed electronic circuitry. Typically,
they are used to isolate circuits from the harmful effects of moisture and
other contaminants, to provide electrical insulation for high voltages and to
protect a circuit and interconnections from thermal and mechanical stresses.
Encapsulants are typically applied in thick layers exceeding 125 mils. |
 | Adhesives and
Sealants |
| Adhesives are used primarily to attach
components, such as module lids and baseplates, within electronic modules and
to seal openings in a module to exclude dirt, water or other contaminants. |
| Thermal interface - Wet
dispensed |  |
| Dow Corning supplies a
line of thermally conductive materials, including curing adhesives, gels and
encapsulants, plus non-curing compounds. The materials are supplied as liquids
and pastes that are dispensed or printed when used. |
 | Thermal interface -
Pads and films |
| Dow Corning supplies many types of
thermal interface materials such as fabricated films and pads, which do not
need to be dispensed or cured. These include thin thermal pads, gap fillers and
phase change films. Fabricated films and pads are supplied ready to use for
those who prefer not to utilize curing processes. |
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